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精品推薦 | IGBT多芯片貼合機

2023-08-21 15:03

設備外形（Equipment Appearance）

總性能優(yōu)勢（Performance Advantages）

精度高，產(chǎn)量多

貼合位置精度±10μm，角度精度±0.1°，且滿足3δ標準。每小時產(chǎn)量可達2000，以標準單顆產(chǎn)品貼一個焊片+一個芯片為基準，設備單次取貼片時間可控制在0.9s以內(nèi)。

Bonding accuracy is ±10μm, Angle accuracy is ±0.1°. The UPH is 2000, with a solder preform and a chip as the benchmark, the cycle time of equipment is within 0.9s.

兼容性強，能兼容多尺寸晶圓盤

可兼容12寸、8寸、6寸及4寸晶圓盤來料，同時兼容Tray盤來料。

Be compatible with 12 inch, 8 inch, 6 inch and 4 inch wafer, and compatible with Tray.

力控范圍大，誤差小

力控范圍40~1000gf，力控誤差在250gf以下能控制在5%以內(nèi)，250gf以上則可控制在10%以內(nèi)。

Bond Force is 40~1000gf, the deviation is within 5% (below 250gf) and is 10% (higher 250g).

組件結(jié)構(gòu)的特色（Modules）

絕對值編碼器，省時省力

軌道調(diào)寬機構(gòu)使用帶絕對值編碼器的伺服電機進行驅(qū)動，便于一鍵切換來料載盤尺寸，減少人工調(diào)節(jié)的時間。

The index width is adjustable by servo motor that to load different size tray, also decrease conversion time of package.

多段諧波凸輪，沖擊小，低風險

載盤抬升使用多段諧波凸輪，減少了傳動鏈，加快了升降機構(gòu)的響應速度，同時諧波凸輪曲線減少了載盤上升或下降過程中的沖擊。彈簧升降導桿使得載盤到上升限位時能夠緩慢過渡，降低了對載盤上表面的沖擊，也降低了由于升降沖擊振動，而致使產(chǎn)品貼合偏離的風險。

The multi-stage harmonic CAM is used to reduce the drive chain and speed up the response of the lifting mechanism, while the harmonic CAM curve reduces the impact during the lifting or lowering of the plate. The spring lift guide allows a slow transition from the carrier to the lift limit, reducing the impact on the surface of the carrier and reducing the risk of product fit deviation due to lift shock vibration.

龍門雙驅(qū)結(jié)構(gòu)，快速又穩(wěn)定

貼合邦頭Y軸采用龍門雙驅(qū)結(jié)構(gòu)，在保證速度的同時，提高了運行的穩(wěn)定性；龍門機構(gòu)底座采用整體鑄鐵結(jié)構(gòu)，降低了運行時振動的影響，整體精度進一步提高。龍門X/Y軸電機外附氣冷裝置，降低了長時間運行溫變帶來的精度影響。

The Y axis of the bond head adopts the double drive structure of gantry, which ensures the speed and improves the stability of operation. The base of the gantry mechanism adopts an integral cast iron structure, which reduces the influence of vibration during operation and further improves the overall accuracy. The external air-cooling device of Gantry X/y axis motor reduces the influence of temperature variation caused by long-time operation.

自動更換芯片頂針和吸嘴

設備支持自動更換芯片頂針和吸嘴，芯片吸嘴庫最多可存放12個吸嘴，頂針帽庫最多可存放6種頂針帽，獨創(chuàng)的擺臂式頂針更換裝置，相比同類設備，更換時間節(jié)省60%，最多可支持同一型號產(chǎn)品4種不同芯片同時貼裝，極大加強了工藝可行性的容度。

The device supports automatic replacement of chip thimbles and nozzles. The chip nozzle library can store up to 12 nozzles, and the thimble cap library can store up to 6 types of thimble caps. The innovative swing arm thimble replacement device saves 60% of replacement time compared to similar devices, and can support up to 4 different chips of the same model product to be installed simultaneously, greatly enhancing the capacity of process feasibility.